I. Overview of Software 

Moldex3D is the world leading CAE product for the plastic injection molding industry. With the best-in-class analysis technology, Moldex3D can help you carry out in-depth simulation of the widest range of injection molding processes and to optimize product designs and manufacturability. In addition, its high compatibility and adaptability have provided users with instant connection to mainstream CAD systems, generating a flexible simulation-driven design platform.



II. Overview Software functions

1. eDesign Basic

Incomplete fill, undesirable weld line location, improper wall thickness are some of the most common molding issues which plastics part designers often encounter. Moldex3D eDesign Basic Package offers designers a powerful tool to quickly verify the part design for manufacturability so as to avoid the above-mentioned molding issues. Plastics designers can utilize the unique auto-meshing function to prepare the model for analysis in no time. Additionally, designers are able to obtain product insights in terms of the pressure required to fill the part, potential weld line and air trap locations, etc. Employing Moldex3D eDesign Basic Package upfront helps companies to design products without manufacturability issues, improve quality and efficiency, reduce development costs, and shorten time to market.



2. eDesign

Moldex3D eDesign offers designers an easy-to-use package to validate their designs behind the desk. The interactive interface that facilitates the part and mold creation and provides auto meshing enables users to work in CAD with no need for advanced CAD knowledge. The accurate 3D model allows you to gain product insights, visualize flow and thermal properties, and optimize processes before physical parts are built. Moldex3D eDesign helps companies to design products with quality, reduce development costs, and shorten time to market.


3. Advanced Solution Package

Moldex3D Advanced Package offers all users, from product and mold designers to advanced CAE experts, the ability to obtain the details of all types of designs, from thin-wall molded parts to complex models with fine features.

In addition, the diversity and robustness of elements ensure the fidelity of solutions. Combining the advantages of 2.5D and 3D modeling, Moldex3D Advanced Package ensures the accurate and efficient performance for every design. Users are able to obtain product insights and properties, and further to optimize processes before physical parts are built. Moldex3D Advanced Package helps companies to design products with confidence, reduce development costs, and shorten time to market.



5. IC Packaging

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.



6. Solution Add-on

Series of add-ons for specific industrial part process simulation:

  • CAD Interoperability
  • Fiber Reinforced Plastics
  • Heat and Cool Management
  • Injection Molded Plastic Optics
  • IC Packaging
  • DOE & Optimization
  • Special Molding processes
  • CAE Professional Assistant




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